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Product Groups
- IGBT/MOSFET Modules
- IGBT/MOSFET Modules
- SiC
- SiC
- IPM (SKiiP)
- IPM (SKiiP)
- Thyristor/Diode Modules
- Thyristor/Diode Modules
- Bridge Rectifiers
- Bridge Rectifiers
- Thyristor/Diode Discretes
- Thyristor/Diode Discretes
- Drivers
- Drivers
- STACKs
- STACKs
- Heat sinks
- Heat sinks
- Others
- Others
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- Low inductance case
- Short tail current with low temperature dependence
- High short circuit capability, self limiting to 6 x Icnom
- Fast & soft inverse CAL diodes
- Isolated copper baseplate using DBC Direct Copper Bonding Technology
- Large clearance (13 mm) and creepage distances (20 mm)
- Switched mode power supplies at  fsw > 20kHz
- Resonant inverters up to 100 kHz
- Inductive heating
- Electronic welders at fsw > 20 kHz
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